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Multisupply Supervisor/Sequencer with ADC and Temperature Monitoring
Preliminary Technical Data
FEATURES
10 supply fault detectors enabling supervision of supplies to better than 1% accuracy 5 selectable input attenuators allow supervision: Supplies up to 14.4 V on VH Supplies up to 6 V on VP1-4 5 dual function inputs VX1-5: High impedance input to supply fault detector with thresholds between 0.573 V and 1.375 V General-purpose logic input Device powered by the highest of VP1-4, VH 2.048 V reference (0.25%) on REFOUT pin 12-bit ADC for read-back of all supervised voltages Reference input, REFIN--2 input options: Driven directly from REFOUT More accurate external reference for improved ADC performance Internal temperature sensor 2 remote temperature sensor inputs 10 programmable output drivers (PDO1-10) Open collector with external pull-up Push-pull output, driven to VDDCAP or VPn Open collector with weak pull-up to VDDCAP or VPn Internally charge pumped high drive for use with external N-FET (PDO1-6 only) Sequencing Engine (SE) implements State Machine control of PDO outputs: State changes conditional on input events Can enable complex control of boards Power up and power down sequence control Fault event handling Interrupt generation on warnings Watchdog function can be integrated in SE Program software control of sequencing through SMBus User EEPROM--256 Bytes Industry standard 2-wire bus interface (SMBus) Guaranteed PDO low with VH, VPn = 1.2V 40-lead LFCSP and 48-lead TQFP packages
ADM1063
FUNCTIONAL BLOCK DIAGRAM
Figure 1.
GENERAL DESCRIPTION
The ADM1063 is a configurable supervisory/sequencing device which offers a single chip solution for supply monitoring and sequencing in multiple supply systems. In addition to these functions the ADM1063 integrates a 12-bit ADC. (continued on Page 3)
APPLICATIONS
Central office systems Servers/routers Multivoltage system line cards DSP/FPGA supply sequencing In circuit testing of margined supplies
Rev. PrJ
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ADM1063 TABLE OF CONTENTS
General Description ......................................................................... 3 ADM1063 Specifications ................................................................. 5 Pin Configurations and Functional Descriptions ........................ 8 Absolute Maximum Ratings............................................................ 9 Thermal Characteristics .............................................................. 9 ESD Caution.................................................................................. 9 Typical Performance Characteristics ........................................... 10 ADM1063 Inputs ............................................................................ 13 Powering the ADM1063 ............................................................ 13 Supply Supervision..................................................................... 14 Input Comparator Hysteresis.................................................... 14 Input Glitch Filtering ................................................................. 14 Supply Supervision with VXN Inputs...................................... 15 Supply Supervision Using the ADC ......................................... 15 VXN Pins as Digital Inputs ....................................................... 16 ADM1063 Outputs......................................................................... 17 ADM1063 Sequencing Engine...................................................... 19 Warnings...................................................................................... 19 SW Flow-Unconditional Jump ................................................. 19
Preliminary Technical Data
End of Step Detector.................................................................. 20 Monitoring Fault Detector ........................................................ 20 Timeout Detector ....................................................................... 21 Temperature Measurement System.............................................. 22 Remote Temperature Measurement ........................................ 22 Communicating with the ADM1063 ........................................... 24 Configuration Download at Power-Up................................... 24 Updating the Configuration of the ADM1063....................... 24 Updating the Sequencing Engine of the ADM1063 .............. 25 Internal Registers of the ADM1063 ......................................... 25 ADM1063 EEPROM.................................................................. 25 Serial Bus Interface..................................................................... 26 Identifying the ADM1063 on the SMBUS .............................. 26 General SMBUS Timing............................................................ 26 SMbus Protocols for RAM and EEPROM .............................. 26 ADM1063 WRITE Operations................................................. 28 ADM1063 READ Operations................................................... 29 Outline Dimensions ....................................................................... 31 Ordering Guide .......................................................................... 32
REVISION HISTORY
Revision PrJ: Preliminary Version
Rev. PrJ | Page 2 of 32
Preliminary Technical Data GENERAL DESCRIPTION
(continued from Page 1) The device also provides up to ten programmable inputs for monitoring Under, Over, or out-of-window faults on up to ten supplies. In addition, ten programmable outputs are provided. These can be used as logic enables. Six of them can also provide up to a +12V output for driving the gate of an N- Channel FET which may be placed in the path of a supply. Temperature measurement is possible with the ADM1063. The device contains one internal temperature sensor and two differential inputs for remote thermal diodes. These are measured using the 12- bit ADC.
ADM1063
The logical core of the device is a Sequencing Engine. This is a state machine based construction, providing up to 63 different states. This enables very flexible sequencing of the outputs, based on the condition of the inputs. The device is controlled via configuration data which can programmed into an EEPROM. All of this configuration can be programmed using an intuitive GUI based software package provided by ADI.
Rev. PrJ | Page 3 of 32
ADM1063
Preliminary Technical Data
Figure 2. Detailed Block Diagram
Rev. PrJ | Page 4 of 32
Preliminary Technical Data ADM1063 SPECIFICATIONS1
VH = 3.0 V to 14.4 V, VPn = 3.0 V to 6.0 V2, TA = -40C to 85C, unless otherwise noted. Table 1.
Parameter POWER SUPPLY ARBITRATION VH, VPn VP VH POWER SUPPLY Supply Current, IVH, IVPn (,Temp Sensor and ADC off) Additional Currents All PDO FET Drivers on Current available from VDDCAP ADC Supply Current EEPROM Erase Current SUPPLY FAULT DETECTORS VH Pin Input Impedance Input attenuator error Detection Ranges High Range Mid Range VPn Pins Input Impedance Detection Ranges Mid Range Low Range Ultra Low Range VX Pins Input Impedance Detection Ranges Ultra Low Range Absolute Accuracy Min 3.0 6.0 14.4 Typ Max Unit V V V Test Conditions/Comments Min. of VDDCAP=2.7V required Max VDDCAP= 5.1V, Typical VDDCAP = 4.75V
ADM1063
6
mA
VDDCAP=4.75V, no PDO FET Drivers on, no loaded PDO pullups to VDDCAP VDDCAP=4.75V, (loaded with 1A), no PDO pullups to VDDCAP. Max. additional load that can be drawn from PDO pullups to VDDCAP Running Round Robin loop 1ms duration only
4 2 1 10
mA mA mA mA
26.7 0.25 6 2.5 80 2.5 1.25 0.573 1 0.573 1.375 1 6 3 1.375 14.4 6
k % V V k V V V M V %
From VH to GND Low, Mid and High ranges on VH, VPn
From VPn to GND
Input attenuator error + Vref Error + DAC Non Linearity + Comparator Offset Error See Figure x. 8 filter length options Die temp higher than ambient due to ADM1063 power consumption 0C <= TDIODE<=120C High Level Low Level
Threshold Resolution Digital Glitch Filter Temperature Sensor Local Sensor Accuracy Remote Sensor Accuracy Remote Sensor Source Current Temperature for 800h code out Temperature for C00h code out
8 0 100 2 2 200 12 0 128
bits s C C A A C C
Rev. PrJ | Page 5 of 32
ADM1063
Parameter Analog to Digital Converter Signal Range Min 0 Typ Max VREFIN Unit V
Preliminary Technical Data
Test Conditions/Comments The ADC can convert signals presented to the VH, VPn and VX_GPIn pins.VPn and VH input signals are attenuated depending on selected range. A signal at the pin corresponding to the selected range will be between 0.573V and 1.375V at the ADC input. VDDCAP=2.7V VDDCAP=4.75V End-point corrected, VREFIN=2.048V VREFIN = 2.048V VREFIN = 2.048V VREFIN = 2.048V Direct input (no attenuator) No Load
Input reference voltage on REFIN pin, VREFIN Resolution INL DNL Gain Error Offset Error Input Noise Reference Output Reference Output Max load current (source) Max load current (sink) Min load capacitance Load regulation PSRR Programmable Driver Outputs High Voltage (Charge Pump) Mode (PDO1-6) Output Impedance VOH Ioutavg Standard (Digital Output Mode (PDO1-10) VOH VPU-0.3 VOL
2.048
TBD TBD
V V bits lsb lsb lsb lsb lsbrms V A A nF mA dB
12 1.5 1 2 2 0.25 2.044 2.048 2.052 200 100
100 20 75
Cap required for decoupling, stability per mA DC
11 10.5
500 12.5 12 20
14
k V V A
IOH =0 IOH =1A 2V < VOH< 7V
2.4 4.5 0.1 0.25 0.5 20 60 20 2
IOL ISINK RPULLUP ISOURCE(VPn)
V V V V V V mA mA k mA
Tristate Output Leakage Current DIGITAL INPUTS (VXn,A0,A1) Input High Voltage, VIH Input Low Voltage, VIL Input High Current, IIH Input Low Current, IIL Input Capacitance Programmable Pulldown Current, IPULLDOWN
10
A
VPU(Pullup to VDDCAP or VPN) = 2.7V, IOH = 0.5mA VPU to Vpn = 6.0V, IOH = 0mA VPU< = 2.7V, IOH = 1mA IOL = 4mA IOL = 10mA IOL = 20mA Max sink current per PDO pin Max total sink for all PDOs Internal pullup Current Load on any VPn pull- ups (ie) total source current available through any number of PDO pull-up switches configured on to any one VPDO= 14.4V
2.0 0.8 -1 1 TBD 10
V V A A pF A
Max. VIN=5.5V Max. VIN=5.5V VIN= 5.5V VIN= 0 If known logic state required
Rev. PrJ | Page 6 of 32
Preliminary Technical Data
Parameter SERIAL BUS DIGITAL INPUTS (SDA,SCL) Input High Voltage, VIH Input Low Voltage, VIL Output Low Voltage, VOL SERIAL BUS TIMING Clock Frequency, fSCLK Bus Free Time, tBUF Start Setup Time, tSU;STA Start Hold Time, tHD;STA SCL Low Time, tLOW SCL High Time, tHIGH SCL, SDA Rise Time, tr SCL, SDA Fall Time, tf Data Setup Time, tSU;DAT Data Hold Time, tHD;DAT
1 2 4
ADM1063
Typ Max Unit Test Conditions/Comments
Min
2.0 0.8 0.4 400 4.7 4.7 4 4.7 4 1000 300 250 300
V V V KHz s s s s s s s ns ns
IOUT = -3.0mA
These are target specifications and subject to change. At least one of the VH, VP1-4 pins must be 3.0V to maintain device supply on VDDCAP. Guaranteed by design.
Rev. PrJ | Page 7 of 32
ADM1063 PIN CONFIGURATIONS AND FUNCTIONAL DESCRIPTIONS
Preliminary Technical Data
Figure 3. LFCSP Pin Configuration
Figure 4. TQFP Pin Configuration
Table 2. Pin Functional Descriptions
LFCSP 1-5 6-9 Pin No. TQFP 1 2-6 7-10 Mnemonic NC VX1-5 VP1-4 Description No connection High impedance inputs to supply fault detectors. Fault thresholds can be set at between 0.573V and 1.375V. Alternatively these pins can be used as general purpose digital inputs. Low voltage inputs to supply fault detectors. Three input ranges can be set by altering the input attenuation on a potential divider connected to these pins, the output of which connects to a supply fault detector; these allow thresholds between 2.5V-6V, 1.25V-3V and 0.573V1.375V. High voltage input to supply fault detectors. Three input ranges can be set by altering the input attenuation on a potential divider connected to this pin, the output of which connects to a supply fault detector; these allow thresholds between 6V-14.4V,2.5V-6V and 1.25V-3V. No connection Ground return for input attenuators. Ground return for on-chip reference circuits. Reference input for ADC, nominally 2.048V. 2.048V reference output. No connection. SMBus clock pin. Open drain output requiring external resistive pull-up. SMBus data i/o pin. Open drain output requiring external resistive pull-up. No connection. Programmable output drivers. No connection Ground return for output drivers Central charge pump voltage of 5.25V. A reservoir capacitor must be connected between this pin and GND. Logic input which sets the 7th bit of the SMBus interface address. Logic input which sets the 6th bit of the SMBus interface address. External Thermal Diode Cathode Connection External Thermal Diode Anode Connection External Thermal Diode Cathode Connection External Thermal Diode Anode Connection Device supply voltage. Linearly regulated from the highest of the VP1-4,VH pins and clamped to a maximum of 4.75V Supply ground. No connection.
10
11
VH
11 12 13 14 15-16 17 18 19-20 21-30 31 32 33 34 35 36 37 38 39 40
12-13 14 15 16 17 18-19 20 21 22-25 26-35 36-37 38 39 40 41 42 43 44 45 46 47 48
NC AGND REFGND REFIN REFOUT NC SCL SDA NC PDO10-1 NC PDOGND VCCP A0 A1 D2N D2P D1N D1P VDDCAP GND NC
Rev. PrJ | Page 8 of 32
Preliminary Technical Data ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Voltage on VH Pin Voltage on VP Pins Voltage on Any Other Input Input Current at any pin Package Input Current Maximum Junction Temperature (TJmax) Storage Temperature Range Lead Temperature, Soldering Vapor Phase, 60 s ESD Rating all pins Rating 17 V 7V -0.3 V to +6.5 V 5 mA 20 mA 150C -65C to +150C 215C 2000 V
ADM1063
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
THERMAL CHARACTERISTICS
40-pin LFCSP Package: JA = TBDC/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. PrJ | Page 9 of 32
ADM1063 TYPICAL PERFORMANCE CHARACTERISTICS
Preliminary Technical Data
Figure 5. DNL for On- Chip 12- Bit ADC
Figure 8. IDD vs. VVP1 (Supply)
Figure 6. INL for On- Chip 12- Bit ADC
Figure 9. IVP1 vs. VVP1 (Not Supply)
Figure 7. VVDDCAP vs. VVH and VVP1
Figure 10. IDD vs. VVH
Rev. PrJ | Page 10 of 32
Preliminary Technical Data
14 13.5 13 12.5 12 11.5 11
1uA L OA D
0 uA L OA D
ADM1063
10.5 10 -40 -25 -10 5 20 35
o
50
65
80
T e m pe r a t u r e (
C)
Figure 11. IVH vs. VVH (Not Supply)
Figure 14. PDO Output (FET Drive Mode) vs. Temperature
4.5 4 3.5 3 2.5 2 1. 5 1 0.5 0 0 0.5 1 I l oa d ( mA) 1. 5 2
V V P 1 =3 . 3 V V V P 1 =5 V
Figure 12. IVX1 vs. VVX1
Figure 15. PDO Output (Strong Pull-Up to VP1) vs. Load Current
4.5 4 3.5 3 2.5 2 1. 5 1 0.5 0 0 10 20 I l o a d ( uA ) 30 40 V V P 1 =3 . 3 V V V P 1 =5 V
Figure 13. Percentage Deviation in VTHRESH vs. Temperature
Figure 16. PDO Output (Weak Pull-up to VP1) vs. Load Current
Rev. PrJ | Page 11 of 32
ADM1063
Preliminary Technical Data
Figure 17. PDO Output (Strong Pull-Down) vs. Load Current
Figure 20. VCCP vs. Load Current
2 1. 8 1. 6 1. 4 1. 2 1 0.8 0.6 0.4 0.2 0 0 20 40 I l o a d ( uA ) 60 80
Figure 18. PDO Output (Weak Pull-Down) vs. Load Current
Figure 21. VXn (Digital Input Mode) Threshold vs. Temperature
Figure 19. Oscillator Frequency vs. Temperature
Rev. PrJ | Page 12 of 32
Preliminary Technical Data ADM1063 INPUTS
POWERING THE ADM1063
The ADM1063 is powered from the highest voltage input on either the Positive Only supply inputs (VPn) or the High Voltage supply input (VH). The same pins are used for supply fault detection (discussed below) . A VDD Arbitrator on the device chooses which supply to use. The arbitrator can be considered an OR'ing of five LDO's together. A supply comparator chooses which of the inputs is highest and selects this one to provide the on- chip supply. There is minimal switching loss with this architecture (~0.2V), resulting in the ability to power the ADM1063 from a supply as low as 3.0V. Note that the supply on the VXn pins cannot be used to power the device. An external cap to GND is required to decouple the on chip supply from noise. This cap should be connected to the VDDCAP pin, as shown in Figure 22. The cap has another use during "brown outs" (momentary loss of power). Under these conditions, where the input supply, VPn or VH, dips transiently below VDD, the synchronous rectifier switch immediately turns off so that it doesn't pull VDD down. The VDD cap can then act like a reservoir and keep the device active until the next highest supply takes over the powering of the device. 10F is recommended for this reservoir/decoupling function. Note that in the case where there are two or more supplies within 100mV of each other, the supply which takes control of VDD first will keep control (e.g) if VP1 is connected to a 3.3V supply, then VDD will power up to approximately 3.1V through VP1. If VP2 is then connected to another 3.3V supply, VP1 will still power the device, unless VP2 goes 100mV higher than VP1.
ADM1063
Figure 22. VDD Arbitrator Operation
The ADM1063 has ten programmable inputs. Five of these are dedicated Supply Fault Detectors (SFD's). These dedicated inputs are called VH and VP1-4 by default. The other five inputs have dual functionality. They can either be used as Supply Fault Detectors, with similar functionality to VH and VP1-4, or they can be used as CMOS/TTL compatible logic inputs to the devices. Thus, the ADM1063 can have up to ten analog inputs, a minimum of five analog inputs and five digital inputs, or a mix. Note that if an input is used as an analog input, it cannot be used as a digital input. Thus, a configuration requiring ten analog inputs would have no digital inputs available. Table 4 shows the details of each of the inputs.
Table 4. Input Functions, Thresholds and Ranges
Input VH VPn Function High V Analog Input Positive Analog Input Voltage Range 2.5V to 6V 4.8V to 14.4V 0.573 to 1.375V 1.25 to 3V 2.5 to 6V 0.573 to 1.375V 0 to 5V Max Hysteresis 425mV 1.16V 97.5mV 212mV 425mV 97.5mV N/A Voltage Resolution 13.7mV 37.6mV 3.14mV 6.8mV 13.7mV 3.14mV N/A Glitch Filter 0-100s 0-100s 0-100s 0-100s 0-100s 0-100s 0-100s
VXn
High Z Analog Input Digital Input
Rev. PrJ | Page 13 of 32
ADM1063
Preliminary Technical Data
Reversing the equation, the code for a desired threshold is given by
N = 255 x (VT - VB ) VR
For example, if the user wishes to set a 5V OV threshold on VP1, the code to be programmed in the PS1OVTH register (discussed in AN-698) would be
N = 255 x (5 - 2.5 ) 3.5
Figure 23. Supply Fault Detector Block
SUPPLY SUPERVISION
The ADM1063 has up to ten Supply Fault Detectors (SFDs) on its ten input channels. These are highly programmable reset generators. This enables the supervision of up to ten supply voltages. These supplies can be as low as 0.573V and as high as 14.4V. The inputs can be configured to detect an Undervoltage fault (where the input voltage droops below a preprogrammed value), an Overvoltage fault (where the input voltage rises above a preprogrammed value) or an Out-Of-Window fault (undervoltage OR overvoltage). The thresholds can be programmed to 8-bit resolution in registers provided in the ADM1063. This translates into a voltage resolution which is dependent on the range selected. The resolution is given by
Thus N = 182 (10110110 Bin, or 0 xB6 )
INPUT COMPARATOR HYSTERESIS
The UV and OV comparators shown in Figure 22 are always looking at VPn. In order to avoid chattering (multiple transitions when the input is very close to the set threshold level), these comparators have digitally programmable hysteresis. The hysteresis can be programmed up to the values shown in Table 4. The hysteresis is added after a supply voltage goes out of tolerance. Thus, the user can program how much above the UV threshold the input must rise again before a UV fault is de-asserted. Similarly, the user can program how much below the OV threshold an input must fall again before an OV fault is de-asserted. The hysteresis figure is given by VHYST = VR x N THREST 255 where:
Step Size = Theshold Rang 255
Thus, if the high range were selected on VH, the UV and
(14.4V - 4.8V ) 255 = 37.6 mV
Listed below are the upper and lower limit of each range available, the bottom of each range and the range itself. The threshold value required is given by
VHYST is the desired hysteresis voltage. NTHRESH is the decimal value of the 5 bit hysteresis code.
Note that NTHRESH has a maximum value of 31. The maximum hysteresis for each of the ranges is quoted in Table 4.
VT = VR X N 255 + VB
(
)
INPUT GLITCH FILTERING
The final stage of the SFD's is a glitch filter. This block provides time domain filtering on the output of the SFD comparators. This allows the user to remove any spurious transitions (such as supply bounce at turn-on). The glitch filter function is additional to the digitally programmable hysteresis of the SFD comparators. The glitch filter timeout is programmable up to 100s. The functionality of the block is best explained using an example. A glitch filter timeout of 100s means that pulses which appear on the input of the glitch filter block and are less than 100_s in duration will be prevented from appearing on the output of the glitch filter block. Any input pulse which is longer in duration than 100s will appear on the output of the glitch filter block. The output will be delayed with respect to the input by 100s. The filtering process is shown in Figure 24.
Table 5.
Voltage Range 0.573 to 1.375V 1.25 to 3V 2.5 to 6V 4.8 to 14.4V VB(V) 0.573 1.25 2.5 4.8 VR(V) 0.802 1.75 3.5 9.6
where:
VT is the desired threshold voltage (UV or OV). VR is the voltage range. N is the decimal value of the 8-bit code. VB is the bottom of the range.
Rev. PrJ | Page 14 of 32
Preliminary Technical Data
SUPPLY SUPERVISION USING THE ADC
ADM1063
A further level of supervision is provided by the on- chip 12 bit ADC. The ADC has a thirteen channel analog mux on the front end. The thirteen channels are the ten SFD inputs, the two external temperature sensors and the internal temperature sensor. Any or all of these inputs can be selected to be read by the ADC. Thus the ADC can be setup to continuously read the selected channels. The circuit controlling this operation is called the "Round Robin". The user selects which channels they wish to operate on, and the ADC performs a conversion on each in turn. Averaging can be turned on, which will set the Round Robin to take 16 conversions on each channel, otherwise a single conversion is made on each channel. At the end of this cycle the results are all written to the output registers and, at the same time, compared with pre-set thresholds to generate any warnings as required. Limit registers are provided on the ADM1063 which the user can program to a maximum or minimum allowable threshold. Only one register is provided for each input channel so an UV or OV threshold but not both can be set for a given channel. Exceeding the threshold generates a Warning which can be read back from the status registers or input into the SE via an OR gate. The round robin can be enabled either via an SMBus write, or can be programmed to turn on at any particular point in the SE program, for instance it can be set to start once a powerup sequence is complete and all supplies are known to be within expected fault limits. Note that there is a latency built into this supervision which is dictated by the conversion time of the ADC. ADC conversions take different times for different input channels due to the sample times being different. With all twelve channels selected the total time for the round robin operation (averaging off) will be approximately 20ms, with the dominant contribution to this being due to the temperature sensor measurement times. Supervision using the ADC, therefore, does not provide the same real time response as the SFD's. The ADC samples single-sided inputs wrt the AGND pin. A 0V input gives out code 0 and an input equal to the voltage on REFIN gives out full code (4095 (dec)) The inputs to the ADC come directly from the VXn pins and from the back of the input attenuators on the VPn and VH pins. The range of voltages expected on these nodes for the supervising functions is the 0.573V to 1.375V of the "UltraLow" supervisory range. It is normal to supply the reference to the ADC on the REFIN pin simply by connecting the REFOUT pin to the REFIN pin. REFOUT provides a 2.048V reference accurate to 0.2%. As such, the supervising range covers less that half of the normal ADC range. It is possible to provide the ADC with a more accurate external reference for improved read-back accuracy. Also, it is possible to connect supplies to the input pins purely for ADC read-back even though they may go above the
Figure 24. Input Glitch Filter Function
SUPPLY SUPERVISION WITH VXN INPUTS
The VXn inputs have two functions. They can either be used as Supply Fault Detectors or as digital logic inputs. When selected to be an analog (SFD) input, the VXn pins have very similar functionality to the VH and VPn pins. The major difference is that the VXn pins have only one input range, 0.573V to 1.375V. Therefore, these inputs can only supervise very low supplies directly. However, the input impedance of the VXn pins is high, allowing an external resistor divide network to be connected to the pin. Thus, any supply can be potentially divided down into the input range of the VXn pin and supervised. This enables other supplies such as +24V, +48V, -5V to be monitored by the ADM1063. An additional Supply Supervision function is available when the VXn pins are selected as digital inputs. In this case, the analog function is available to be used as a second detector on each of the dedicated analog inputs, VP1-4 and VH. THe analog function of VX1 is mapped to VP1, VX2 is mapped to VP2 etc. VX5 is mapped to VH. In this case, these SFD's can be viewed as a secondary or "Warning" SFD. These secondary SFD's are fixed to the same input range as the primary SFD. They are used to indicate Warning levels rather than Failure levels. This allows faults and warnings to be generated on a single supply using only one pin. For example, if VP1 was set to output a fault if a 3.3V supply drooped to 3.0V, VX1 could be set to output a warning at 3.1V. Warning outputs are available for readback from the status registers. They are also OR'ed together and fed into the Sequencing Engine (SE), allowing Warnings to generate interrupts on the PDO's. Thus, in the example above, if the supply drooped to 3.1V, a warning would be generated, and remedial action could be taken before the supply dropped out of tolerance.
Rev. PrJ | Page 15 of 32
ADM1063
expected supervisory range limits (though not above 6V as this would violate the absolute maximum ratings on these pins). For instance a 1.5V supply connected to the VX1 pin would correctly read out as an ADC code of approximately 3/4 Full scale but would always sit above any supervisory limits that could be set on that pin. It is not possible to set REFIN to higher than 2.048V.
Preliminary Technical Data
programmable width is outputted from the digital block. The width is programmable from 0s to a maximum of 100s. The digital blocks feature the same glitch filter function available on the SFD's. This enables the user to ignore spurious transitions on the inputs. For example, the filter can be used to debounce a manual reset switch. When configured as digital inputs, each of the VXn pins has a weak (10A) pull-down current source available for placing the input in a known condition, even if left floating. The current source, if selected, weakly pulls the input to GND.
VXN PINS AS DIGITAL INPUTS
As outlined previously, the VXn inputs pins on the ADM1063 have dual functionality. The second function is as a digital input to the device. Thus, the ADM1063 can be configured to have up to five digital inputs. These inputs are TTL/CMOS compatible. Standard logic signals can be applied to the pins: RESET from reset generators, PWRGOOD signals, fault flags, manual resets, and so on. These signals are available as inputs to the SE, and so can be used to control the status of the PDO's. The inputs can be configured to detect either a change in level or an edge. When configured for level detect, the output of the digital block is simply a buffered version of the input. When configured for edge detect, once the logic transition is detected, a pulse of
Figure 25. VXn Digital Input Function
Rev. PrJ | Page 16 of 32
Preliminary Technical Data ADM1063 OUTPUTS
SUPPLY SEQUENCING THROUGH CONFIGURABLE OUTPUT DRIVERS
Supply sequencing is achieved with the ADM1063 by using the Programmable Driver Outputs (PDO's) on the device as control signals for supplies. The Output drivers can either be used as logic enables or as FET drivers. The sequence in which the PDO's are asserted (and, thus, the supplies are turned on) is controlled by the Sequencing Engine (SE). The SE determines what action is to be taken with the PDO's based on the condition of the inputs of the ADM1063. Thus, the PDO's can be set up to assert when the SFD's are in tolerance, the correct input signals are received on the VXn digital pins, there are no warnings from any of the inputs of the device, and so on. The PDO's can be used for a number of functions: the primary function is to provide Enable signals for LDO's or DC/DC convertors which generate supplies locally on a board. The PDO's can also be used to provide a POWER_GOOD signal when all of the SFD's are in tolerance or provide a RESET output if one of the SFD's goes out of spec (this can be used as a status signal for a DSP, FPGA or other microcontroller). The PDO's can be programmed to pull- up to a number of different options. The outputs can be programmed as:-
* Open Drain (allowing the user to connect an external pull-up resistor) * Open Drain with weak pull-up to VDD * Push Pull to VDD * Open-drain with weak pull-up to VPn * Push-pull to VPn * Strong pull-down to GND * Internally charge- pumped high drive (12V- PDO 1- 6 Only)
ADM1063
than 10.5V into a 1A load). The pull-down switches may be used to drive status LEDs. The data driving each of the PDO's can come from one of three sources. The source can be enabled in the PnPDOCFG configuration register (refer to AN-698). The data sources are:
* An output from the SE. * Directly from the SMBus. A PDO can be configured so that the SMBus has direct control over it. This enables software control of the PDO's. Thus, a microcontroller could be used to initiate a software power-up/power-down sequence. * An On- Chip Clock. A 100KHz clock is generated on the device. This clock can be made available on any of the PDO's. It could be used to clock an external device such as a LED, for example.
The default condition of the PDO's is to be pulled to GND by a weak (20k) on-chip pull-down resistor. This is also the condition of the PDO's on power-up until the configuration is downloaded from EEPROM and the programmed setup is latched. The outputs are actively pulled low once there is a supply 1V or greater on VPn or VH. The outputs remain high impedance prior to 1V appearing on VPn or VH. This provides a known condition for the PDO's during power-up. The internal pull-down can be overdriven with an external pull-up of suitable value tied from the PDO pin to the required pullup voltage. The 20k resistor must be accounted for in calculating a suitable value. For example, if it was required to pull PDOn up to 3.3V, and 5V was available as an external supply, the pull-up resistor value is given by:-
3.3V = 5V x 20 k (RUP + 20 k )
Therefore,
The last option (available only on PDO's 1 to 6) allows the user to directly drive a voltage high enough to fully enhance an external N-fet which is used to isolate, for example, a card-side voltage from a backplane supply (a PDO will sustain greater
RUP = (100 k - 66 k ) 3.3 = 10 k
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ADM1063
Preliminary Technical Data
Figure 26. Programmable Driver Output
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Preliminary Technical Data ADM1063 SEQUENCING ENGINE
The ADM1063 incorporates a Sequencing Engine (SE) which provides the user with powerful and flexible control of sequencing. The SE implements a state machine control of the PDO outputs, with state changes conditional on input events. SE programs can enable complex control of boards, such as powerup and power down sequence control, fault event handling, interrupt generation on warnings etc. A watchdog function, to verify the continued operation of a processor clock, can be integrated into the SE program. The SE can also be controlled via the SMBus, giving software or firmware control of the board sequencing Considering the function of the SE from an applications viewpoint it is most instructive to think of the SE as providing a "state" for a state machine. This state has the following attributes:
* it is used to monitor signals indicating the status of the 10 input pins, VP1-4, VH and VX1-VX5 * it can be entered from any other state * there are three exit routes which move the state machine on to a "next state", these are:
ADM1063
* the transition from one state to the next is made in less than 20s. This is the time taken to download a state definition from EEPROM to the SE.
Figure 27. State Cell
The ADM1063 offers up to 63 such state definitions. The signals being monitored to indicate the status of the input pins are the outputs of the SFD's.
WARNINGS
The SE is also monitoring the Warnings. These are generated by ADC readings violating their limit register value or by the secondary voltage monitors on VP1-4, VH. These are all OR'ed together and available as a single "Warnings" input to each of the three blocks which enable exiting from a state.
SW FLOW-UNCONDITIONAL JUMP
The SE can be forced to advance to the next state unconditionally. This enables the user to force the SE to advance. Examples where this might be used include moving to a margining state or as a method of debugging a sequence. The SW Flow or Go to command can be seen as another input to End of Step and Timeout blocks which provide an exit from each state.
1. 2. 3.
End of Step detection Monitoring fault Timeout
* delay timers for the End of Step and Timeout blocks above can be programmed independently and will change with each state change. The range of timeouts is from 0ms to 400ms * the output condition of the 10 PDO pins is defined and fixed within a state
Table 6. Example Sequence States Entries
State IDLE1 IDLE2 EN3V3 DIS3V3 EN2V5 DIS2V5 FSEL1 FSEL2 PWRGD End of Step If VX1 is LOW then go to State IDLE2 If VP1 is OK then go to State EN3V3 If VP2 is OK then go to State EN2V5 If VX1 is HIGH then go to State IDLE1 If VP3 is OK then go to State PWRGD If VX1 is HIGH the go to State IDLE1 If VP3 is NOT OK then go to State DIS2V5 If VP2 is NOT OK then go to State DIS3V3 If VX1 is HIGH then go to State DIS2V5 Timeout Monitor
If VP2 is NOT OK after 10ms then goto State DIS3V3 If VP3 is NOT OK after 20ms then goto State DIS2V5
If VP1 is NOT OK then goto State IDLE1
If VP1 OR VP2 is NOT OK then goto State FSEL2 If VP1 OR VP2 is NOT OK then goto State FSEL2 If VP1 is NOT OK then goto State IDLE1 If VP1 OR VP2 OR VP3 is NOT OK then goto State FSEL1
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ADM1063
SEQUENCING ENGINE APPLICATION EXAMPLE
An example application will be considered here to demonstrate the operation of the SE. Figure 28 below shows how the simple building block of a single SE state can be used to build up a power-up sequence for a 3-supply system. Table 6 below textually describes the same SE implementation. In this system the presence of a "good" 5V supply on VP1, and the VX1 pin being held low, are the trigger required for an up sequence to start. The sequence intends to turn on the 3.3V supply next, then the 2.5V supply (assuming successful turn-on of the 3.3V supply). Once all 3 supplies are good the PWRGD state is entered, where the SE will remain until a fault occurs on one of the 3 supplies, or it is instructed to go through a power-down sequence by VX1 going high. Faults are dealt with on the way through the up sequence on a case-by case basis. The text below which describes the individual blocks will use the example application to demonstrate what the state machine is doing.
Preliminary Technical Data
Figure 29. PDO outputs for each state
END OF STEP DETECTOR
This block is used to detect when a step in a sequence has been completed. It is simply looking for one of the inputs to SE to change state and is most often used to be the gate on successful progress through an up or down sequence. A timer block is included, in this detector- it can be thought of as a way to insert delays into an up or down sequence, if required. Timer delays can be set from 10s to 400ms. Figure 30 shows a block diagram of the End of Step Detector.
Figure 30. End-of-Step Detector
It is also possible to use the End of Step Detector to help identify monitoring faults. In the example application shown in Figure 28 it can be seen how the FSEL1 and FSEL2 states are being used to identify which of VP1,VP2 or VP3 has faulted and to take the appropriate action.
MONITORING FAULT DETECTOR
This block is used to detect a failure on any one of a number of inputs. The logical function implementing this is a wide OR gate which is used to detect when any one of a number of inputs deviates from its' expected condition. The clearest demonstration of the use of this block is in the PWRGD state where the monitor block will indicate that a failure on any one of the VP1,VP2 and VP3 inputs has occurred. There is no programmable delay available in this block. This is because, the triggering of a fault condition is likely to be caused by a supply falling out of tolerance, a situation to which the user will want to react to as quickly as possible. There is some latency in moving out of this state, however, since it takes a finite time (~20s) for the state configuration to download from EEPROM into the SE. Figure 31 below shows a block diagram of the Monitoring Fault Detector.
Figure 28. Flow Diagram
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Preliminary Technical Data
TIMEOUT DETECTOR
ADM1063
This block is included to allow the user to trap a failure to make proper progress through an up or down sequence. In the example application we can see the timeout next state transition being used from the EN3V3 and EN2V5 states. In the case of the EN3V3 state, the signal 3V3ON is asserted on entry to this state (on the PDO1 output pin) to turn on a 3.3V supply. This supply rail is connected to the VP2 pin and the End of Step detector is looking for the VP2 to go "good" (going above its' UV threshold, which will be set on the Supply Fault Detector (SFD) attached to that pin). Progress forward in the up sequence is made when this change is detected.
Figure 31. Monitoring Fault Detector
If, however, the supply failed to go "good" - perhaps because of a short circuit over-loading this supply - then the timeout block allows this problem to be trapped. In the example shown, if the 3.3V supply does not go good within 10ms then the SE moves to the DIS3V3 state and turns off this supply by bringing PDO1 low. It also indicates that a fault has occurred by taking PDO3 high. Timeout delays of between 0s and 400ms can be programmed.
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ADM1063 TEMPERATURE MEASUREMENT SYSTEM
The ADM1063 contains an on-chip band gap temperature sensor, whose output is digitized by the on-chip 12-bit ADC. Theoretically, the temperature sensor and ADC can measure temperatures from -128C to +127C with a resolution of 0.125C. However, this exceeds the operating temperature range of the device, so local temperature measurements outside this range are not possible. Temperature measurement from -127C to +127C is possible using a remote sensor. The code out is in offset binary format, with -128C given by code 400h, 0C given by 800h and +127C given by C00h. As with the other analog inputs to the ADC, a limit register is provided for each of the temperature input channels. Thus, a temperature limit can be set, such that if it is exceeded, a Warning is generated and is available as an input to the sequencing engine. This enables the user to control their sequence or monitor functions based on an over temperature or under temperature event.
Preliminary Technical Data
Figure 32 shows the input signal conditioning used to measure the output of a remote temperature sensor. This figure shows the external sensor as a substrate transistor, provided for temperature monitoring on some microprocessors, but it could equally well be a discrete transistor such as a 2N3904/06. If a discrete transistor is used, the collector will not be grounded, and should be linked to the base. If a PNP transistor is used the base is connected to the DN input and the emitter to the DP input. If an NPN transistor is used, the emitter is connected to the DN input and the base to the DP input. Figure 33 and Figure 34 shows how to connect the ADM1063 to an NPN or PNP transistor for temperature measurement. To prevent ground noise interfering with the measurement, the more negative terminal of the sensor is not referenced to ground, but is biased above ground by an internal diode at the DN input. To measure Vbe, the sensor is switched between operating currents of I and N x I. The resulting waveform is passed through a 65kHz low pass filter to remove noise, and to a chopper-stabilized amplifier that performs the functions of amplification and rectification of the waveform to produce a DC voltage proportional to Vbe,. This voltage is measured by the ADC to give a temperature output in 12-bit offset binary. To further reduce the effects of noise, digital filtering is performed by averaging the results of 16 measurement cycles. A remote temperature measurement takes nominally 600s. The results of remote temperature measurements are stored in 12 bit, offset binary format, as illustrated in. This gives temperature readings with a resolution of 0.125C.
REMOTE TEMPERATURE MEASUREMENT
The ADM1063 can measure the temperature of two remote diode sensors or diode-connected transistors, connected to pins 35, 36, 37, 38, on the LFCSP package and pins 42, 43, 44 and 45 on the TQFP package (pins DxN and DxP). The forward voltage of a diode or diode-connected transistor, operated at a constant current, exhibits a negative temperature coefficient of about -2mV/C. Unfortunately, the absolute value of Vbe varies from device to device, and individual calibration is required to null this out, so the technique is unsuitable for mass-production. The technique used in the ADM1063 is to measure the change in Vbe when the device is operated at two different currents. This is given by:
Vbe = KT q x In( N )
where:
K is Boltzmann's constant. q is charge on the carrier. T is absolute temperature in Kelvin. N is ratio of the two currents.
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Preliminary Technical Data
ADM1063
Figure 32. Signal Conditioning for Remote Diode temperature Sensors
Table 7. Temperature Data Format
Temperature -128C -125C -100C -75C -50C -25C -10C 0C +10.25C +25.5C +50.75C +75C +100C +125C +128C Digital Output (Hex) 400 418 4E0 5A8 600 670 7B0 800 852 8CC 996 A58 B48 BE8 C00 Digital Output (Bin) 010000000000 010000011000 010011100000 010110101000 011000000000 011001110000 011110110000 100000000000 100001010010 100011001100 100110010110 101001011000 101101001000 101111101000 110000000000
Figure 33. Measuring Temperature Using a NPN Transistor
Figure 34. Measuring Temperature Using a PNP Transistor
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ADM1063 COMMUNICATING WITH THE ADM1063
CONFIGURATION DOWNLOAD AT POWER-UP
The configuration of the ADM1063- the UV/OV thresholds, glitch filter timeouts, PDO configurations etc, is dictated by the contents of RAM. The RAM is comprised of digital latches which are local to each of the functions on the device. The latches are "double buffered" and actually comprised of two identical latches, Latch A and Latch B. Thus, the update of a function first updates the contents of Latch A and then updates the contents of Latch B with identical data. The advantage of the architecture is explained in detail below. These latches are volatile memory and lose their contents at power- down. Therefore, at power- up the configuration in the RAM must be restored. This is achieved by downloading the contents of the EEPROM (non- volatile memory) to the local latches. This download occurs in a number of steps. 1. 2. With no power applied to the device, the PDO's are all high impedance. Once 1V appears on any of the inputs connected to the VDD Arbitrator (VH or VPn), the PDO's are all weakly pulled to GND with a 20k impedance. Once the supply rises above the Under voltage Lockout of the device (UVLO is 2.5V), the EEPROM starts to download to the RAM. The EEPROM downloads its contents to all Latch A's. Once the contents of the EEPROM are completely downloaded to Latch A's, the device controller signals all Latch A's to download to all Latch B's simultaneously, thus completing the configuration download. 0.5ms after the configuration download, the first state definition is downloaded from EEPROM into the Sequencing Engine
Preliminary Technical Data
The ADM1063 provides a number of options which allow the user to update the configuration differently over the SMBus interface. All of these options are controlled in the register UPDCFG. The options are: 1. Update the configuration in real time. The user writes to RAM across the SMBus and the configuration is updated immediately. Update A Latches without updating the B Latches. With this method, the configuration of the ADM1063 will remain unchanged and continue to operate in the original setup until the instruction is given to update the B Latches. Change EEPROM register contents without changing the RAM contents, and then download the revised EEPROM contents to the RAM registers. Again, with this method, the configuration of the ADM1063 will remain unchanged and continue to operate in the original setup until the instruction is given to update the RAM.
2.
3.
3.
4. 5.
The instruction to download from the EEPROM in option 3 above is also a useful way to restore the original EEPROM contents if revisions to the configuration are unsatisfactory. If the user alters, say, an OV threshold they can do this by updating the RAM register as described in 1 above. If they are not satisfied with this change and wish to revert to the original programmed value, then the device controller can issue a command to download the EEPROM contents to the RAM again, thus restoring the ADM1063 to its original configuration. This type of operation is possible because of the topology of the ADM1063. The Local (volatile) registers, or RAM, are all double buffered latches. Setting bit 0 of the UPDCFG register to 1 leaves the double buffered latches open at all times. If bit 0 is set to 0, then when RAM write occurs across the SMBus only the first side of the double buffered latch is written to. The user must then write a 1 to bit 1 of the UPDCFG register. This generates a pulse to update all of the second latches at once. Similarly with EEPROM writes. A final bit in this register is used to enable EEPROM page erasure. If this bit is set high, then the contents of an EEPROM page can all be set to 1. If low, then the contents of a page cannot be erased, even if the command code for page erasure is programmed across the SMBus. The bitmap for register UPDCFG is shown in AN-698. A flow chart for download at power up and subsequent configuration updates is shown in Figure 35 overleaf.
6.
Note- Any attempt to communicate with the device prior to this download completion will result in a NACK being issued from the ADM1063.
UPDATING THE CONFIGURATION OF THE ADM1063
Once powered up, with all of the configuration settings loaded from EEPROM into the RAM registers, the user may wish to alter the configuration of functions on the ADM1063 (eg) change the UV or OV limit of an SFD, change the fault output of an SFD, change the rise time delay of one of the PDO's etc.
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Preliminary Technical Data
ADM1063
Figure 35. Configuration Update Flow Diagram
UPDATING THE SEQUENCING ENGINE OF THE ADM1063
The update of the SE functions differently to the regular configuration latches. The SE has its own dedicated 512 byte EEPROM for storing State definitions, providing 63 individual states with a 64- bit word each (one state is reserved). At powerup, the first state is loaded from the SE EEPROM into the engine itself. When the conditions of this state are met, the next state is loaded from EEPROM into the engine, and so on. The loading of each new state takes approximately 20s. If a state is to be altered, then the required changes must be made directly to EEPROM. RAM for each state does not exist. The relevant alterations must be made to the 64- bit word, which is then uploaded directly to EEPROM.
(EEPROM), from register addresses F800h to FBFFh. This may be used for permanent storage of data that will not be lost when the ADM1063 is powered down, one EEPROM cell containing the configuration data of the device, the other containing the State definitions for the Sequencing Engine. Although referred to as Read Only Memory, the EEPROM can be written to (as well as read from) via the serial bus in exactly the same way as the other registers. The only major differences between the E2PROM and other registers are: 1. 2. 3. An EEPROM location must be blank before it can be written to. If it contains data, it must first be erased. Writing to EEPROM is slower than writing to RAM. Writing to the EEPROM should be restricted because it has a limited write/cycle life of typically 10,000 write operations, due to the usual EEPROM wear-out mechanisms.
INTERNAL REGISTERS OF THE ADM1063
The ADM1063 contains a large number of data registers. A brief description of the principal registers is given below.
Address Pointer Register: This register contains the address that selects one of the other internal registers. When writing to the ADM1063, the first byte of data is always a register address, which is written to the Address Pointer Register. Configuration Registers: Provide control and configuration for various operating parameters of the ADM1063.
The first EEPROM is split into 16 (0 to 15) pages of 32 Bytes each. Pages 0 to 6, starting at address F800, hold the configuration data for the applications on the ADM1063 (the SFD's, PDO's etc.). These EEPROM addresses are the same as the RAM register addresses, prefixed by F8. Page 7 is reserved. Pages 8 to 15 are for customer use. Data can be downloaded from EEPROM to RAM in one of two ways:- 1. 2. At Power- up, pages 0 to 6 are downloaded. Setting bit 0 of the UDOWNLD Register (D8h) performs a user download of pages 0 to 6.
ADM1063 EEPROM
The ADM1063 has two 512 byte cells of non-volatile, Electrically-Erasable Programmable Read-Only Memory
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ADM1063
SERIAL BUS INTERFACE
Control of the ADM1063 is carried out via the serial System Management Bus (SMBus). The ADM1063 is connected to this bus as a slave device, under the control of a master device. It takes approximately 1ms after power up for the ADM1063 to download from it's EEPROM. Therefore access is restricted to the ADM1063 until the download is completed. 2.
Preliminary Technical Data
master will write to the slave device. If the R/W bit is a 1 the master will read from the slave device. Data is sent over the serial bus in sequences of 9 clock pulses, 8 bits of data followed by an Acknowledge Bit from the slave device. Data transitions on the data line must occur during the low period of the clock signal and remain stable during the high period, as a low to high transition when the clock is high may be interpreted as a STOP signal. If the operation is a write operation, the first data byte after the slave address is a command byte. This tells the slave device what to expect next. It may be an instruction such as telling the slave device to expect a block write, or it may simply be a register address that tells the slave where subsequent data is to be written. Since data can flow in only one direction as defined by the R/W bit, it is not possible to send a command to a slave device during a read operation. Before doing a read operation, it may first be necessary to do a write operation to tell the slave what sort of read operation to expect and/or the address from which data is to be read. When all data bytes have been read or written, stop conditions are established. In WRITE mode, the master will pull the data line high during the 10th clock pulse to assert a STOP condition. In READ mode, the master device will release the SDA line during the low period before the 9th clock pulse, but the slave device will not pull it low. This is known as No Acknowledge. The master will then take the data line low during the low period before the 10th clock pulse, then high during the 10th clock pulse to assert a STOP condition
IDENTIFYING THE ADM1063 ON THE SMBUS
The ADM1060 has a 7-bit serial bus slave address. When the device is powered up, it will do so with a default serial bus address. The five MSB's of the address are set to 00111, the two LSB's are determined by the logical states of pin A1 and A0. This allows the connection of 4 ADM1063's to the one SMBus. The device also has a number of identification registers (read only) which can be read across the SMBus. Table 8 lists these registers, their values, and functions.
Table 8.
Name Address MANID F4h REVID F5h MARK1 F6h MARK2 F7h Value 41h --h --h --h Function Manufacturer ID for Analog Devices Silicon Revision S/w brand S/w brand
3.
GENERAL SMBUS TIMING
Figure 36, Figure 37 and Figure 38 show timing diagrams for general read and write operations using the SMBus. The SMBus specification defines specific conditions for different types of read and write operation, which are discussed later. The general SMBus protocol operates as follows: 1. The master initiates data transfer by establishing a START condition, defined as a high to low transition on the serial data line SDA whilst the serial clock line SCL remains high. This indicates that a data stream will follow. All slave peripherals connected to the serial bus respond to the START condition, and shift in the next 8 bits, consisting of a 7-bit slave address (MSB first) plus a R/W bit, which determines the direction of the data transfer, i.e. whether data will be written to or read from the slave device (0 = write, 1 = read). The peripheral whose address corresponds to the transmitted address responds by pulling the data line low during the low period before the ninth clock pulse, known as the Acknowledge Bit, and holding it low during the high period of this clock pulse. All other devices on the bus now remain idle whilst the selected device waits for data to be read from or written to it. If the R/W bit is a 0 then the
SMBUS PROTOCOLS FOR RAM AND EEPROM
The ADM1063 contains volatile registers (RAM) and nonvolatile EEPROM. User RAM occupies address locations from 00h to DFh, whilst EEPROM occupies addresses from F800h to FBFFh. Data can be written to and read from both RAM and EEPROM as single data bytes. Data can only be written to unprogrammed EEPROM locations. To write new data to a programmed location it is first necessary to erase it. EEPROM erasure cannot be done at the byte level, the EEPROM is arranged as 32 pages of 32 bytes, and an entire page must be erased. Page erasure is enabled by setting bit 2 in register UPDCFG (address 90h) to 1. If this is not set then page erasure cannot occur, even if the command byte (FEh) is programmed across the SMBus.
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Preliminary Technical Data
ADM1063
Figure 36. General SMBus Write Timing Diagram
Figure 37. General SMBus Read Timing Diagram
Figure 38. Diagram for Serial Bus Timing
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ADM1063
ADM1063 WRITE OPERATIONS
The SMBus specification defines several protocols for different types of read and write operations. The ones used in the ADM1063 are discussed below. The following abbreviations are used in the diagrams: S P R - - - START
Preliminary Technical Data
for page erasure to take place, the page address has to be given in the previous write word transaction (see write byte below). Also, bit 2 in register UPDCFG (address 90h) must be set to 1.
Figure 40. EEPROM Page Erasure
STOP READ WRITE ACKNOWLEDGE NO ACKNOWLEDGE
W- A A - -
As soon as the ADM1063 receives the command byte, page erasure begins. The master device can send a STOP command as soon as it sends the command byte. Page erasure takes approximately 20ms. If the ADM1063 is accessed before erasure is complete, it will respond with a NACK.
Write Byte/Word
In this operation the master device sends a command byte and one or two data bytes to the slave device, as follows: 1. 2. 3. 4. 5. 6. 7. 8. 9. The master device asserts a start condition on SDA. The master sends the 7-bit slave address followed by the write bit (low). The addressed slave device asserts ACK on SDA. The master sends a command code. The slave asserts ACK on SDA. The master sends a data byte. The slave asserts ACK on SDA. The master sends a data byte (or may assert STOP at this point). The slave asserts ACK on SDA.
The ADM1063 uses the following SMBus write protocols:
Send Byte
In this operation the master device sends a single command byte to a slave device, as follows: 1. 2. 3. 4. 5. 6. The master device asserts a start condition on SDA. The master sends the 7-bit slave address followed by the write bit (low). The addressed slave device asserts ACK on SDA. The master sends a command code. The slave asserts ACK on SDA. The master asserts a STOP condition on SDA and the transaction ends.
In the ADM1063, the send byte protocol is used for two purposes. 1. To write a register address to RAM for a subsequent single byte read from the same address or block read or write starting at that address. This is illustrated in Figure 39.
10. The master asserts a STOP condition on SDA to end the transaction. In the ADM1063, the write byte/word protocol is used for three purposes. 1. Write a single byte of data to RAM. In this case the command byte is the RAM address from 00h to DFh and the (only) data byte is the actual data. This is illustrated in Figure 41
Figure 39. Setting A RAM Address For Subsequent Read
2.
Erase a page of EEPROM memory. EEPROM memory can be written to only if it is unprogrammed. Before writing to one or more EEPROM memory locations that are already programmed, the page or pages containing those locations must first be erased. EEPROM memory is erased by writing a command byte. The master sends a command code that tells the slave device to erase the page. The ADM1063 command code for a pages(s) erasure is FEh (11111110). Note that, in order
Figure 41. Single Byte Write To RAM
2.
Set up a two byte EEPROM address for a subsequent read, write, block read, block write or page erase. In this case the command byte is the high byte of the EEPROM address
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Preliminary Technical Data
from F8h to FBh. The (only) data byte is the low byte of the EEPROM address. This is illustrated in Figure 42.
ADM1063
10. The master asserts a STOP condition on SDA to end the transaction.
Figure 44. Block Write To EEPROM Or RAM
Figure 42. Setting An EEPROM Address
Note for page erasure that as a page consists of 32 bytes only the three MSB's of the address low byte are important. The lower 5 bits of the EEPROM address low byte only specify addresses within a page and are ignored during an erase operation. 3. Write a single byte of data to EEPROM. In this case the command byte is the high byte of the EEPROM address from F8h to FBh. The first data byte is the low byte of the EEPROM address and the second data byte is the actual data. This is illustrated in Figure 43
Unlike some EEPROM devices which limit block writes to within a page boundary, there is no limitation on the start address when performing a block write to EEPROM, except: 1. There must be at least N locations from the start address to the highest EEPROM address (FBFFh), to avoiding writing to invalid addresses. If the addresses cross a page boundary, both pages must be erased before programming.
2.
Figure 43. Single Byte Write To EEPROM
Note that the ADM1063 features a clock extend function for writes to EEPROM. Programming an EEPROM byte takes approximately 250s, which would limit the SMBus clock for repeated or block write operations. The ADM1063 pulls SCL low and extends the clock pulse when it cannot accept any more data.
ADM1063 READ OPERATIONS
Block Write
In this operation the master device writes a block of data to a slave device. The start address for a block write must previously have been set. In the case of the ADM1063 this is done by a Send Byte operation to set a RAM address or a Write Byte/Word operation to set an EEPROM address. 1. 2. 3. 4. The master device asserts a start condition on SDA. The master sends the 7-bit slave address followed by the write bit (low). The addressed slave device asserts ACK on SDA. The master sends a command code that tells the slave device to expect a block write. The ADM1063 command code for a block write is FCh (11111100). The slave asserts ACK on SDA. The master sends a data byte that tells the slave device how many data bytes will be sent. The SMBus specification allows a maximum of 32 data bytes to be sent in a block write. The slave asserts ACK on SDA. The master sends N data bytes. The slave asserts ACK on SDA after each data byte.
Figure 45. Single Byte Read From EEPROM Or RAM
The ADM1063 uses the following SMBus read protocols:
Receive Byte
In this operation the master device receives a single byte from a slave device, as follows: 1. 2. 3. 4. 5. 6. The master device asserts a START condition on SDA. The master sends the 7-bit slave address followed by the read bit (high). The addressed slave device asserts ACK on SDA. The master receives a data byte. The master asserts NO ACK on SDA. The master asserts a STOP condition on SDA and the transaction ends.
5. 6.
In the ADM1063, the receive byte protocol is used to read a single byte of data from a RAM or EEPROM location whose address has previously been set by a send byte or write byte/word operation. This is illustrated in Figure 45.
7. 8. 9.
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ADM1063
Block Read
In this operation the master device reads a block of data from a slave device. The start address for a block read must previously have been set. In the case of the ADM1063 this is done by a Send Byte operation to set a RAM address, or a Write Byte/Word operation to set an EEPROM address. The block read operation itself consists of a Send Byte operation that sends a block read command to the slave, immediately followed by a repeated start and a read operation that reads out multiple data bytes, as follows: 1. 2. 3. 4. The master device asserts a START condition on SDA. The master sends the 7-bit slave address followed by the write bit (low). The addressed slave device asserts ACK on SDA. The master sends a command code that tells the slave device to expect a block read. The ADM1063 command code for a block read is FDh (11111101). The slave asserts ACK on SDA. The master asserts a repeat start condition on SDA. The master sends the 7-bit slave address followed by the read bit (high). The slave asserts ACK on SDA. The ADM1063 sends a byte count data byte that tells the master how many data bytes to expect. The ADM1063 will always return 32 data bytes (20h), which is the maximum allowed by the SMBus 1.1 specification.
Preliminary Technical Data
Figure 46. Block Read From EEPROM or RAM
Error Correction
The ADM1063 provides the option of issuing a PEC (Packet Error Correction) byte after a write to RAM, a write to EEPROM, a block write to RAM/EEPROM or a block read from RAM/EEPROM. This enables the user to verify that the data received by or sent from the ADM1063 is correct. The PEC byte is an optional byte sent after that last data byte has been written to or read from the ADM1063. The protocol is as follows:- 1. The ADM1063 issues a PEC byte to the master. The master should check the PEC byte and issue another block read if the PEC byte is incorrect. A NACK is generated after the PEC byte to signal the end of the read.
5. 6. 7. 8. 9.
2.
Note: The PEC byte is calculated using CRC-8. The Frame Check Sequence (FCS) conforms to CRC-8 by the polynomial:-
C(x ) = x 8 + x 2 + x 1 + 1
Consult SMBus 1.1 specification for more information. An example of a block read with the optional PEC byte is shown in Figure 47 below.
10. The master asserts ACK on SDA. 11. The master receives 32 data bytes. 12. The master asserts ACK on SDA after each data byte. 13. The master asserts a STOP condition on SDA to end the transaction.
Figure 47. Block Read From EEPROM or RAM with PEC
Rev. PrJ | Page 30 of 32
Preliminary Technical Data OUTLINE DIMENSIONS
ADM1063
Figure 48. 40-Lead 6x6 Chip Scale Package (CP-40) Dimensions shown in millimeters
Figure 49. 48-Lead 7x7 TQFP Package (SU-48) Dimensions shown in millimeters
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ADM1063
ORDERING GUIDE
Model ADM1063ACP ADM1063ASU Temperature Range -40C to +85C -40C to +85C Package Description 40-Lead LFCS 48-Lead TQFP
Preliminary Technical Data
Package Option CP-40 SU-48
(c) 2003 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. C04632-0-12/03(PrJ)
Rev. PrJ | Page 32 of 32
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